? semiconductor components industries, llc, 2007 march, 2007 ? rev. 1 1 publication order number: NTLJD2105L/d NTLJD2105L power mosfet 8 v, 4.3 a, cool high side load switch with level shift, 2x2 mm wdfn package features ? wdfn 2x2 mm package with exposed drain pads offers excellent thermal performance ? low r ds(on) p?channel load switch with n?channel mosfet for level shift ? n channel operated at 1.5 v gate drive voltage level ? p channel operated at 1.5 v supply voltage ? same footprint as sc88 ? low profile (<0.8 mm) allows it to fit easily into extremely thin environments ? esd protection ? these are pb?free devices applications ? high slide load switch with level shift ? optimized for power management in ultra portable equipment mosfet(q2) maximum ratings (t j = 25 c unless otherwise stated) parameter symbol value unit q2 input voltage (v ds , p?channel) v in 8 v q1 on/off voltage (v gs , n?channel) v on/off 6 v continuous load current (note 1) steady state t a = 25 c i l 4.3 a t a = 85 c 3.1 power dissipation (note 1) steady state t a = 25 c p d 1.56 w continuous load current (note 2) steady state t a = 25 c i l 2.5 a t a = 85 c 1.8 power dissipation (note 2) t a = 25 c p d 0.52 w pulsed load current t p = 10 s i lm 20 a operating junction and storage temperature t j , t stg ?55 to 150 c source current (body diode) (note 2) i s ?2.7 a lead temperature for soldering purposes (1/8? from case for 10 s) t l 260 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 1. surface?mounted on fr4 board using 1 in sq pad size (cu area = 1.127 in sq [2 oz] including traces) 2. surface?mounted on fr4 board using the minimum recommended pad size. 1 2 3 6 5 4 s1 g1 d2 d1/g2 s2 http://onsemi.com 20 v 60 m @ 2.5 v 50 m @ 4.5 v r ds(on) max 4.3 a i l max v inmax 80 m @ 1.8 v 115 m @ 1.5 v jn = specific device code m = date code = pb?free package wdfn6 case 506az marking diagram (top view) see detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. ordering information pin connections jn m 1 2 3 6 5 4 d2 q1 q2 2, 3 6 4 5 1 pin 1 d1/g2 d2 (note: microdot may be in either location)
NTLJD2105L http://onsemi.com 2 thermal resistance ratings parameter symbol max unit junction?to?ambient ? steady state (note 3) r ja 80 c/w junction?to?ambient ? t 5 s (note 3) r ja 38 c/w junction?to?ambient ? steady state min pad (note 4) r ja 180 c/w 3. surface mounted on fr4 board using 1 in sq pad size (cu area = 1.127 in sq [2 oz] including traces). 4. surface?mounted on fr4 board using the minimum recommended pad size. electrical characteristics (t j = 25 c unless otherwise specified) parameter symbol test condition min typ max unit off characteristics q2 drain?to?source breakdown voltage v (br)dss v gs = 0 v, i d = 250 a ?8.0 v q2 forward leakage current i fl v on/off = 0 v, v in = 8.0 v t j = 25 c 0.1 a t j = 85 c 1 q1 gate?to?source leakage current i gss v ds = 0 v, v gs1 = 6 v 100 n a q1 diode forward on?voltage v sd i s = ?1.0 a, v gs1 = 0 v ?0.8 ?1.1 v on characteristics q1 on/off voltage v on/off 1.5 8.0 q1 gate threshold voltage v gs1(th) v gs1 = v ds1 , i d = 250 a 0.40 1.0 v q2 input voltage v in 1.8 8.0 v q2 drain?to?source on resistance r ds(on) v in = 4.5 v, i l = 4.0 a 33 50 m v in = 2.5 v, i l = 3.0 a 40 60 v in = 1.8 v, i l = 1.7 a 60 80 v in = 1.5 v, i l = 1.2 a 75 115 q2 load current i l v drop 0.2 v, v in = 2.5 v, v on/off = 1.5 v 1.0 a v drop 0.3 v, v in = 1.8 v, v on/off = 1.5 v 1.0
NTLJD2105L http://onsemi.com 3 typical performance curves (t j = 25 c unless otherwise noted) 0 0.20 1 0.10 0.00 0.35 24 figure 1. voltage drop versus load current @ v in = 4.5 v figure 2. voltage drop versus load current @ v in = 2.5 v figure 3. voltage drop versus load current @ v in = 1.8 v figure 4. voltage drop versus load current @ v in = 1.5 v i l , load current (amps) v drop , voltage drop (v) v in = 1.5 v t j = 25 c 0.05 0.15 3 0.30 0.25 t j = 85 c 0 0.20 1 0.10 0.00 24 i l , load current (amps) v drop , voltage drop (v) v in = 1.8 v t j = 25 c 0.05 0.15 3 0.25 t j = 85 c t j = 85 c 0 0.20 1 0.10 0.00 24 i l , load current (amps) v drop , voltage drop (v) v in = 2.5 v t j = 25 c 0.05 0.15 3 t j = 85 c 01 0.10 0.00 24 i l , load current (amps) v drop , voltage drop (v) v in = 4.5 v t j = 25 c 0.05 0.15 3
NTLJD2105L http://onsemi.com 4 typical performance curves (t j = 25 c unless otherwise noted) figure 5. turn?on (v in = 1.5 v, r l = 3 , r1 = 1 k , r2 = 0, c1 = 47 nf) figure 6. turn?off (v in = 1.5 v, r l = 3 , r1 = 1 k , r2 = 0, c1 = 47 nf) figure 7. turn?on (v in = 1.5 v, r l = 3 , r1 = 10 k , r2 = 1 k , c1 = 47 nf) figure 8. turn?off (v in = 1.5 v, r l = 3 , r1 = 10 k , r2 = 1 k , c1 = 47 nf) figure 9. turn?on (v in = 3 v, r l = 3 , r1 = 10 k , r2 = 1 k , c1 = 47 nf) figure 10. turn?off (v in = 3 v, r l = 3 , r1 = 10 k , r2 = 1 k , c1 = 47 nf)
NTLJD2105L http://onsemi.com 5 typical performance curves (t j = 25 c unless otherwise noted) figure 11. thermal response t, time (sec) 1 1000 0.1 0.2 0.02 d = 0.5 0.05 0.01 single pulse d curves apply for power pulse train shown read time at t 1 t j(pk) ? t a = p (pk) r ja (t) p (pk) t 1 t 2 duty cycle, d = t 1 /t 2 100 1000 10 0.1 0.001 0.0001 0.000001 0.1 100 10 1 0.01 0.00001 effective transient thermal resistance v out gnd load c o c1 r2 c i v in r1 on/off gnd figure 12. load switch application q1 q2 2, 3 6 6 4 5 1 components description value r1 to 1.0 m * to 100 k * f 1000 pf *minimum r1 value should be at least 10 x r2 to ensure q1 turn?on. ordering information device package shipping ? NTLJD2105Ltbg wdfn6 (pb?free) 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
NTLJD2105L http://onsemi.com 6 package dimensions notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.20mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. 5. pins 2 & 3 connected to large flag. 6. pin 6 connected to small flag. c a seating plane d b e 0.10 c a3 a a1 2x 2x 0.10 c wdfn6, 2x2 case 506az?01 issue a dim a min max millimeters 0.70 0.80 a1 0.00 0.05 a3 0.20 ref b 0.25 0.35 d3 0.085 ref d d2 e e2 e 0.41 ref g l pin one reference 0.08 c 0.10 c 6x a 0.10 c note 3 l e d3 e2 b b 3 6 6x 1 k 4 6x 0.05 c d2 g2 note 5 g2 0.80 1.00 2.00 bsc 0.30 0.50 2.00 bsc 0.90 1.10 0.65 bsc 0.20 0.30 bottom view 2.30 6x pitch 1 0.45 0.35 0.65 dimensions: millimeters 1.05 0.38 0.11 g note 6 0.25 ref k 6x 0.43 0.95 6x 4x 2x *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. NTLJD2105L/d cool is a trademark of semiconductor components industries, llc (scillc). publication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5773?3850 literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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